Silicon Photonics Assembly and Packaging Page
India's First End-to-End Silicon Photonics Manufacturing Partner
About izmomicro
izmomicro is proud to be the first company in India offering dedicated Silicon Photonics manufacturing services, including advanced packaging and assembly solutions. Our services address the complex requirements of photonic device packaging, including optical alignment, thermal management, heterogeneous integration, and environmental reliability – critical factors for high-performance telecom, datacom, and sensing applications.
Photonic Device Packaging Challenges
Packaging of photonic devices presents significant challenges due to the need for:
Precise Optical Alignment
We ensure sub-micron accuracy in aligning fiber arrays, wave guides, and laser sources, to minimize insertion losses and maximize efficiency.
Thermal Management
We develop solutions to handle heat dissipation while maintaining optical performance and preventing thermal drift.
Scalability and Manufacturability
We provide cost-effective, high yield, and automated packaging solutions to support large-scale production without compromising performance.
Heterogeneous Integration
We have expertise to seamlessly integrate the photonic and electronic components in a compact and reliable package, considering different material properties and interconnection methods.
Environmental Reliability
We carry out ESS (Environmental Stress Screening) tests to ensure long-term reliability under varying temperature, humidity, and mechanical stress conditions.
Solutions We Offer
Package Design
Our approach to package design includes:
Fiber-to-Chip Alignment
Ease of fiber-to-chip and chip-to-chip sub-micron accuracy active alignment
Thermal Management
Thermal management using thermal vias, heat spreaders, and thermoelectric coolers (TECs)
High-Speed Electrical Routing
High-speed electrical routing to minimize parasitics and ensure efficient signal and power integrity
Material Selection
Packaging material selection for optical and thermal stability, stress management, and shock & vibration resistance
Heterogeneous Integration
Heterogeneous packaging with 2.5D and 3D integration capabilities
Test and Validation
We design and develop custom test systems that can be integrated into automated test handlers. These test systems ensure performance and reliability before high-volume rollout.
Custom Test Systems
We design and develop custom test systems tailored to your specific requirements
Automation Integration
Our test systems can be integrated into automated test handlers
Performance Verification
Comprehensive testing ensures performance and reliability
Production Readiness
Validation before high-volume rollout
Manufacturing
Our Key Capacities
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Fine-kerf wafer dicing equipment |
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High-accuracy die attach systems |
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Sub-micron accuracy active fiber alignment tools |
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Precision fiber attach systemsunications |
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Precision wire bonding machinesmunications |
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Production lines equipped for mid-volume photonics manufacturingmmunications |
Why izmomicro?
- First company in India to offer Silicon Photonics manufacturing services
- Extensive experience in Silicon Photonics package design and packaging services
- Proven track record in 2.5D and 3D package design and packaging
- Continuous investment in capabilities and infrastructure
- Active collaboration with IIT Madras for R&D and innovation
Contact Our PIC Experts
We're ready to bring your next-generation photonic devices to life.
Use the form below to reach out to us and start a conversation.
