izmomicro: custom SiP & IC Packaging for high-density, high-performance systems
We provide circuit designers, developers, and hardware engineers with access to a state-of-the-art infrastructure for silicon photonics development. Our services span the entire product lifecycle—from concept to commercialization—enabling rapid innovation and reliable deployment.
Design & Simulation
Leverage advanced simulation tools and expert support to design photonic circuits optimized for performance and reliability from the start.
Testing & Packaging
We offer high-performance photonic packaging with rigorous testing to ensure industry compliance and meet your specific application requirements.
Manufacturing
From low-volume research units to full-scale commercial production, our flexible and scalable manufacturing capabilities adapt to your needs.
Powering the Future of Integrated Electronics
izmomicro is redefining semiconductor innovation through advanced packaging solutions, delivered through next generation system design and India-based 3D packaging infrastructure.
IC Packaging & SiP Solutions
High Reliability Components
RF & MW Assemblies & Packaging
Co-Packaged Optics
EV / Green Energy Power Modules
System Design & Manufacturing
Enabling Precision at Scale
Advanced Manufacturing Expertise
Specializing in System-in-Package (SiP) and Surface Mount Technology (SMT) solutions, delivered from a state-of-the-art Class 1000 cleanroom facility.
High-Precision Capabilities
Equipped with 3D die stacking, flip-chip assembly, fine-pitch wire bonding, automated molding, and thick film hybrid substrate production.
Industry-Grade Quality
SiP and Multi-Chip Module (MCM) assembly designed to meet the stringent requirements of high-tech industrial and aerospace applications.
Safeguarding Innovation & Intellectual Property Rights
We are dedicated to upholding the highest standards of confidentiality and integrity in protecting your intellectual property. Our secure development protocols, combined with advanced SiP packaging techniques, create an inherent layer of IP protection by integrating complex systems into discreet, non-discernible modules further safeguarding your competitive advantage.