Ashok Arcade, Plot Nos. 51 & 52, EPIP Industrial Area, Whitefield, Bangalore - 560066.

SIP Packaging Options

Packages

Leaded Packages
Dual In-line Package (DIP), Plastic Quad Flat Package (PQFP), and more.
Leadless Packages
Quad Flat No-leads (QFN), Ball Grid Array (BGA), Land Grid Array (LGA), and beyond.
Specialty Packages
Ceramic Quad Flat Package (CQFP), Ceramic Pin Grid Array (CPGA), & Ceramic Ball Grid Array (CBGA), for environments demanding the highest reliability.

Facilities

Our SiP packaging & SMT plants are located in India

The packaging facility is a Class 1000 Clean Room well equipped with High Precision die placement having 3-D Die Stacking & Flip chip capability, Fine pitch wire bonding, Auto Molding, Thick film hybrid substrate manufacturing, SiP & MCM assembly to hi-tech. industrial & Space requirements.

Leverage the power of our advanced packaging capabilities, to build products at the leading edge of innovation, performance, and miniaturization.

 
Intellectual Property Protection
We value your intellectual property (IP) and uphold the strictest security protocols to ensure the confidentiality and integrity of your designs.

Our SiP solutions provide an inherent layer of IP protection by integrating complex systems into non-discernible modules, further safeguarding your competitive advantage.

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