izmo Microsystems Pvt.Ltd.: Bangalore, Karnataka

izmo micro: custom SiP & IC Packaging for high-density, high-performance systems

Wide range of packaging options to accommodate diverse design specifications and functional requirements, including complex mixed-technology assemblies.

Meet izmo microsystems, the hi-tech semiconductor and systems company specializing in System-in-Package (SiP) miniaturization, with India based facilities for 3D packaging.

IC Packaging & SiP Solutions

High Reliability Components

RF & MW Assemblies & Packaging

Co-Packaged Optics

EV / Green Energy Power Modules

System Design & Manufacturing

Innovation, Performance, Miniaturization

Performance-Centric Approach

Utilizing the latest in die-attach methods, wire bonding, and flip-chip technologies, we ensure optimal electrical and thermal performance.

Our packages are designed to minimize parasitics and maximize heat dissipation, ensuring superior performance even in the most rigorous conditions.

Form Factor Optimization

With a focus on miniaturization, izmo micro’s SiP solutions enable significant reductions in PCB real estate.

We offer compact form factors without sacrificing functionality for developing sleeker, more portable devices, giving our clients a competitive edge in their markets.

Speed to Market

Our streamlined design and rapid prototyping capabilities enable accelerated development processes, from initial concept to full-scale production.

By integrating multiple functionalities into a single SiP solution, we help customers achieve faster time-to-market, staying ahead of rapidly evolving technology trends.

SIP Packaging Options

Packages

Leaded Packages
Dual In-line Package (DIP), Plastic Quad Flat Package (PQFP), and more.
Leadless Packages
Quad Flat No-leads (QFN), Ball Grid Array (BGA), Land Grid Array (LGA), and beyond.
Specialty Packages
Ceramic Quad Flat Package (CQFP), Ceramic Pin Grid Array (CPGA), & Ceramic Ball Grid Array (CBGA), for environments demanding the highest reliability.

Facilities

Our SiP packaging & SMT plants are located in India

The packaging facility is a Class 1000 Clean Room well equipped with High Precision die placement having 3-D Die Stacking & Flip chip capability, Fine pitch wire bonding, Auto Molding, Thick film hybrid substrate manufacturing, SiP & MCM assembly to hi-tech. industrial & Space requirements.

Leverage the power of our advanced packaging capabilities, to build products at the leading edge of innovation, performance, and miniaturization.

Intellectual Property Protection
We value your intellectual property (IP) and uphold the strictest security protocols to ensure the confidentiality and integrity of your designs.
Our SiP solutions provide an inherent layer of IP protection by integrating complex systems into non-discernible modules, further safeguarding your competitive advantage.

Contact izmo microsystems
For more Information on izmo’s services, fill in the form.